Apparatus and method for projecting an alignment image

ABSTRACT

A testing system operable to accurately position a plurality of contact electrodes relative to a plurality of electrical contacts is disclosed. For one embodiment, the testing system comprises a first imaging system coupled to a wafer chuck. The wafer chuck is used to place the electrical contacts of a wafer in contact with the plurality of electrodes. To facilitate accurate positioning between the wafer electrical contacts and the contact electrodes, the first imaging system is configured to locate the plurality of contact electrodes. The testing system also comprises a second imaging system configured to locate the wafer electrical contacts. An image generator coupled to the first imaging system generate an alignment image on a focal point of the first imaging system. The testing system calibrates the first imaging system to the second imaging system using the alignment image.

FIELD OF THE INVENTION

[0001] The present invention relates to an apparatus and method forprojecting an alignment image. More particularly, the present inventionrelates to an apparatus and method that generates a projected reticleimage to facilitate the calibration between a moveable direct probesensor camera and a fixed camera.

BACKGROUND OF THE INVENTION

[0002] Improvements in manufacturing processes has led to an increase inthe density and complexity of semiconductor devices placed on a singlesilicon wafer. The increased density of semiconductor devices, however,has reduced the accuracy of wafer sorts. Wafer sort, or wafer probe,describes the process of using probe cards to identify semiconductordevices at the wafer stage of manufacture that have inter-connectivityor electrical malfunctions prior to the individual packaging of thesemiconductor devices. In particular, a probe card includes a collectionof electrical contacts, pins, or probes that are positioned to makecontact with the bonding pads of the semiconductor device under test(“DUT”). Subsequently, Automatic Test Equipment (“ATE”) electricallyconnected to the probe cards, generates electrical tests to examine theinterconnectivity or electrical operation of the DUT.

[0003] As the density of semiconductor devices increase, the dimensionsof the probe card have dramatically shrunk to ensure proper probe-to-padalignment. Probe-to-pad alignment describes accurately positioning thebonding pads of a semiconductor device located on a wafer in such a waythat the bonding pads of the device make good electrical contact withthe probe tips of the probe card. The modified probe card dimensions,however, create numerous problems during probe-to-pad alignment. Toensure accurate probe-to-pad alignment numerous methods have beendeveloped in the prior art.

[0004] One method of a prior art probe-to-pad alignment uses a dummywafer in conjunction with an auto-align fixed camera. The fixed camerais a downward looking camera with a fixed position and a known field ofview. Using the fixed downward looking camera to view the bonding padsand other features on a wafer, the location of the bond pads on the DUTare determined in horizontal dimensions ‘x’ and ‘y.’ The ‘z,’ orvertical location, of the wafer surface, or equivalently, of the bondpads, is determined using a separate system. Next, a dummy wafer with asoft markable surface, such as an aluminum layer, is probed. The probingcauses the probe tips to leave indentations on the dummy wafer. Based onthe location of the probe indentations the fixed camera determines the‘x-y’ coordinates of the probe tips relative to the dummy wafer. Usingthe derived ‘x-y’ coordinates of the probe tips, the prober positionsthe bond pads of a DUT in contact with the probe tips. Thus,probe-to-pad alignment is achieved. The method of using dummy wafers forprobe-to-pad alignment, however, has numerous drawbacks. In particular,this method results in wasted wafers, possible damage of probe tips,reliance on an alternate system to measure ‘z’ coordinates, and relianceon probe indentations to interpret actual probe tip position.

[0005] To counteract the reliance on dummy wafers, prior art probersdeveloped a direct probe sensor (“DPS”) camera. In the prior art, theDPS camera is used in conjunction with the fixed camera to align probetips and bond pads. In particular, the DPS camera is an upward lookingcamera that records the x, y, and z coordinates of the probe tips of aprobe card. As previously described, the fixed camera is a down wardlooking camera that determines the x, y, and z coordinates of the bondpads of a DUT located on a wafer. Based on the x, y, and z coordinatesof the probe tips and the bond pads, the prober positions the wafer toalign the probe tips of the probe card with the bond pads of the DUT.

[0006]FIG. 1 illustrates a prior art prober using a DPS camera. Inparticular, system 100 includes a probe card 160 with probe tips 165.System 100 also includes lens system 120, physical reticle 140, and DPS110—a charge coupled device (“CCD”) that records images on pixel grid115. System 100 records the location of probe tips 165 via lens system120. System 100 also includes wafer chuck 170. Wafer chuck 170 iscoupled to lens system 120. System 100 moves wafer chuck 170 in the x,y, and z coordinates to place a wafer (not shown) in contact with probetips 165. System 100 also moves wafer chuck 170 in the x, y, and zcoordinates to record the location of probe tips 165.

[0007] Prior to recording the probe tip locations, the x, y, and zcoordinates of the field of view of DPS 110 is calibrated with a fixedcamera (not shown). As previously described, the fixed camera is adownward looking camera with a fixed position and a known field of view.The calibration between DPS 110 and the fixed camera is performed viaphysical reticle 140. In the prior art, physical reticle 140 is a thinplate of glass with cross-hair pattern 150 located in the center of theglass plate. During calibration, physical reticle 140 is placed at thefocal point of DPS 110—denoted as focal 180. Using the image generatedby cross-hair pattern 150, DPS 110 generates a pixel representation ofcross-hair pattern 150 on pixel grid 115. The pixel representation isrelayed to a prober (not shown). Subsequently, housing 170 movesphysical reticle 140 under the fixed camera and the fixed camera's fieldof vision relative to cross-hair pattern 150 is determined and relayedto the prober.

[0008] The prober correlates the pixel representation of cross-hairpattern 150 generated by DPS 110 to the known location and field of viewof the fixed camera. Thus, the position of a probe tip viewed by DPS 110is accurately determined because both cameras, DPS 110 and the fixedcamera, are calibrated to each other by focusing on the sameintermediate target—cross-hair 150. Using physical reticle 140 foralignment between DPS 110 and the fixed camera, however, create numerousdisadvantages.

[0009] One disadvantage of using a physical reticle results from thedesign characteristics of the physical reticle. In particular, aspreviously described, physical reticle 140 is designed using a glassplate. The glass pate, however, creates an image offset because there isan optical path difference between glass and the air surroundingphysical reticle 140. The image offset results in a shifted cross-hair150, which in turn results in a calibration offset in the “z” direction.

[0010] Another disadvantage of using a physical reticle results from therequirement of operator intervention of the physical reticle. Inparticular, physical reticle 140 is removed during non-calibration (i.e.normal testing) use. Thus, full automation is prevented.

[0011] Yet another disadvantage of using a physical reticle results fromthe close proximity of the physical reticle to the probe tips. Inparticular, during the calibration of DPS 110, the physical reticle 110may cause damage to the probe tips through accidental contact.

SUMMARY OF THE INVENTION

[0012] A testing system operable to accurately position a plurality ofcontact electrodes relative to a plurality of electrical contacts isdisclosed. For one embodiment, the testing system comprises a firstimaging system coupled to a wafer chuck. The wafer chuck is used toplace the electrical contacts of a wafer in contact with the pluralityof electrodes. To facilitate accurate positioning between the waferelectrical contacts and the contact electrodes, the first imaging systemis configured to locate the plurality of contact electrodes. The testingsystem also comprises a second imaging system configured to locate thewafer electrical contacts. To calibrate the objects viewed by the firstimaging system and the second imaging system, an image generator coupledto at least one of the imaging systems generates an alignment imagealong the optical path of the imaging system. The testing systemcalibrates positioning and imaging information between the first imagingsystem and the second imaging system using the alignment image.

[0013] According to another embodiment, an imaging system operable togenerate an alignment image is disclosed. The imaging system comprisesan image generator configured to generate the alignment image. Theimaging system also comprises an objective coupled to the imagegenerator that has an optical path including an objective lens, a rearimage forming lens, and a beam-splitter coupled between the objectivelens and the rear image forming lens. The beam-splitter is configured toinject the alignment image into the optical path of the imaging system.For one embodiment, the imaging system generates the alignment image onthe focal point of the imaging system via a charge coupled device.Specifically, a reflective charge coupled device is coupled to theobjective. The reflective charge coupled device is configured to reflectthe alignment image onto the focal point of the imaging system.

[0014] For yet another embodiment, the alignment image projected on thecharge coupled device and the reflected alignment image are opticallyconjugate points. Thus, a second imaging system viewing the projectedalignment image of a first imaging system results in both imaging systemviewing the identical image at the same point in space.

[0015] Other features and advantages of the present invention will beapparent from the accompanying drawings and from the detaileddescription that follows.

BRIEF DESCRIPTION OF THE DRAWINGS

[0016] The features and advantages of the present invention areillustrated by way of example and not limitation in the figures of theaccompanying drawings in which like references indicate similar elementsand in which:

[0017]FIG. 1 illustrates a prior art direct probe sensor camera;

[0018]FIG. 2 illustrates one embodiment of an automatic test equipment;

[0019]FIG. 3 illustrates one embodiment of a direct probe sensor cameragenerating a calibration image;

[0020]FIG. 4 illustrates one embodiment of an objective included in thedirect probe sensor camera of FIG. 3;

[0021]FIG. 5a illustrates one embodiment of an image generator includedin the direct probe sensor camera of FIG. 3; and

[0022]FIG. 5b illustrates one embodiment of a charge coupled deviceincluded in the direct probe sensor camera of FIG. 3.

DETAILED DESCRIPTION

[0023] An automatic test equipment that generates an image to calibratea direct probe sensor camera and a wafer sort camera is disclosed. Forone embodiment, the image is generated within the direct probe sensor(“DPS”) camera. The generated image is located at the focal point of theDPS camera. In the present embodiment, both the DPS camera and the wafersort camera include a charge coupled device (“CCD”) to record viewedobjects. Accordingly, the generated image is located at both the focalpoint of the DPS camera and on the CCD of the DPS camera. Duringcalibration, the DPS camera records the pixel location of the image onthe CCD of the DPS. Alternatively, during calibration, the DPS camerarecords the pixel location of the image on the CCD of the DPS. The DPScamera transfers the pixel representation to a prober. Subsequently, theprober moves the image over to the wafer sort camera. The wafer sortcamera focuses on the image and generates a pixel representation of theimage. Alternatively, the wafer sort camera focuses on the image andrecords the pixel location of the image. The pixel image recorded by thewafer sort camera is also transferred to the prober. Accordingly, foreach pixel, the prober correlates the pixel image recorded by DPS camerato the pixel image recorded by the wafer sort camera, thus calibratingthe two camera system. The calibration allows the prober to position afirst object viewed by the DPS camera relative to a second object viewedby the wafer sort camera.

[0024] For one embodiment, the prober uses the DPS camera to view probepins of a probe card. The prober also uses the wafer sort camera to viewbond pads. Accordingly, the calibration allows the prober to accuratelyplace the probe pins in contact with the bond pads. For anotherembodiment, the wafer sort camera is replace by a wafer alignmentcamera.

[0025] For an alternative embodiment, the calibration between the DPScamera and the wafer sort camera is implemented without the generatedimage. Instead, the entire CCD of the DPS is illuminated. After theillumination of the DPS CCD, the prober moves the DPS camera below thewafer sort camera. Subsequently, the wafer sort camera records theposition of the pixels of the CCD included in the DPS camera. The probercorrelates the pixels recorded by the wafer sort camera to the actualpixels of the DPS camera, thus calibrating the two camera system.

[0026]FIG. 2 illustrates an embodiment of an automatic test equipment(“ATE”) implemented by the present invention. In particular, system 200comprises a wafer chuck (202) coupled to an orientation mechanism (204)in a manner which allows wafer chuck 202 to be moved in the X, Y, Z, andtheta directions 290. Wafer chuck 202 accepts the attachment of a wafer(222). System 200 also includes a probe card holder (240) which acceptsa probe card (230). For one embodiment, probe card 230 may be any of thedifferent varieties of probe cards, including for example membrane probecards. For an alternative embodiment, probe card holder 240 may beconfigured to provide movement of probe card 230 in any of the X, Y, Z,or theta directions 290. As illustrated in FIG. 2, probe card 230includes a number of conducting contact electrodes. The contactelectrodes may in one embodiment include metallic pins (232). Providedthe probe card and the wafer are properly aligned by system 200, pins232 make contact with pads 224 of wafer 222, thus allowing system 200 totest the inter-connectivity and electrical operation of devices locatedon wafer 222. For one embodiment, pads 224 comprise any contactelectrode surface including, but not limited to, a flat surface, asolder bump, pins, or posts.

[0027] Pads 224 and pins 232 are placed in contact via direct probesensor (“DPS”) camera 206-210 and fixed camera 220, alternativelyreferred to as a wafer alignment camera. In particular, DPS camera206-210, is configured to view pins 232 on probe card 230. Fixed camera220 is coupled to a fixed reference point, base 250, and is configuredto view pads 224 on wafer 222. For one embodiment, system 200 uses thelocation of pins 232 recorded by DPS camera 206-210 in conjunction withthe current pad 224 location viewed by fixed camera 220 to incrementallymove wafer chuck 202 until pads 224 come in contact with probe pins 232.For alternative embodiments, fixed camera 220, may contain both coaxialand oblique illumination sources. For another embodiment, probe cardholder 240 is coupled to base 250. For yet another embodiment, system200 includes a computer system (not shown) with a central processingunit and memory. Based on the DPS camera 206-210 and fixed camera 220data, computer system applies control signals to orientation mechanism(204), thus moving wafer chuck 202 until pads 224 come in contact withprobe pins 232. The computer system is also used to calibrate DPS camera206-210 and fixed camera 220.

[0028] As illustrated in FIG. 2, DPS camera 206-210 and fixed camera 220comprise two physically disjointed camera systems. Specifically, thecamera systems do not share the same objective or lenses. Thus,calibration between the two camera systems is necessary to ensure theaccurate positioning of wafer chuck 202 relative to pins 232.

[0029] For one embodiment, the calibration between the two systems isperformed by an image generated by DPS camera 206-210. In particular,both DPS camera 206-210 and fixed camera 220 simultaneously focus on thegenerated image. Subsequently, system 200 correlates the image andpositioning information determined by DPS camera 206-210 with the imageand positioning information determined by fixed camera 220, thuscalibrating the two cameras.

[0030] For an alternative embodiment, DPS camera 206-210 focuses on thegenerated image, hereinafter referred to as a calibration image oralternatively as an alignment image. Subsequently, orientation mechanism204 moves the generated image below fixed camera 220 so that fixedcamera 220 can focus on the generated image. Based on the movement oforientation mechanism 204 and the images record by both cameras, system200 determines the relative position between the two camera's focalpoints. Thus, calibrating DPS camera 206-210 to fixed camera 220. For analternative system, based on the movement of orientation mechanism 204and the images recorded by both cameras, a computer system coupled tosystem 200 determines the relative position between the two camera'sfocal points.

[0031]FIG. 3 illustrates one embodiment of a DPS camera generating acalibration image. In particular, system 300 includes an objective (330)coupled to both an image generator (320) and a CCD (310). For oneembodiment, system 300 is a video microscope with a fixed field of view.For an alternative embodiment, system 300 generates a calibration image(340) at the focal point (350) of the video microscope.

[0032] For one embodiment, system 300 is included in system 200.Accordingly, section 206 of DPS camera 206-210 corresponds to objective330. Similarly, sections 208 and 210 of DPS camera 206-210 correspond toimage generator 320 and CCD 310, respectively.

[0033] As illustrated in FIG. 3, image 340 is cross-hair pattern locateddirectly above objective 330. Accordingly, CCD 310 generates a pixelrepresentation of the cross-hair pattern. For one embodiment, the imagerecorded by CCD 310 is correlated to a fixed camera recording of image340, thus resulting in the calibration of system 300 and the fixedcamera. For another embodiment, system 300 generates a calibration imageby illuminating either all or a subset of all the pixels included in CCD310. The illuminated pixels are subsequently recorded by a fixed camera.Accordingly, each pixel detected by the fixed camera is correlated toeach pixel recorded by CCD 310, thus calibrating the fixed camera andsystem 300.

[0034]FIG. 4 illustrates one embodiment of an objective included in theDPS camera of FIG. 3. In particular, objective 400 includes a rear imageforming lens (420), a beam-splitter (430), and an objective lens (440).Objective 400 also includes three illumination paths (410 a-c).Illumination path 410 b and 410 c are the normal optical path throughwhich objective 400 views images.

[0035] For one embodiment, beam-splitter 430 is a partially reflectingmirror with an anti-reflective coat on side ‘A’ and a plane of glasscoated for 4-6% refection on side ‘B.’ For alternative embodiments, thereflective qualities of the glass coat is varied based on the lightgenerated from path 410 b. The dual qualities of beam-splitter 430 allowthe beam splitter to either deflect light from path 410 a to 410 b or toeffectively transmit light in a bi-directional fashion between path 410c and path 410 b. It will be appreciated by one skilled in the art, thatthe reflective qualities of beam-splitter 430, the displacement of thelenses (420 and 440), and the magnification strength of the lenses (420and 440) may be varied depending on the focal point and illuminationcharacteristics of the video microscope that houses objective 400.

[0036] For one embodiment, objective 400 is used in DPS camera 206-210of system 200. Accordingly, objective 400 is coupled to image generator208 CCD 210 at nodes 411 a and 411 b, respectively. System 200 controlsthe light source generated along illumination paths 410 a-c to performtwo functions, probe-to-pad alignment and calibration. In particular,during probe-to-pad alignment, system 200 turns image generator 208 off.Thus, only ambient light source information (including images of probepins 232) is transmitted from path 410 c to path 410 b. Subsequently,the ambient light source information is recorded by CCD 210. Inparticular, it will be appreciated by one skilled in the art that thearrangement of system 200 does not interfere with the use or placementof other illumination sources, such as coaxial or oblique illumination,that are normally associated with normal image generation in opticalsystems.

[0037] To perform the calibration function, system 200 turns imagegenerator 208 on, thus generating a light source that includes acalibration image along path 410 a. Beam-splitter 430 deflects the lightsource transmitted on path 410 a and injects the calibration image intothe normal path of light in objective 400, path 410 b. In particular,beam-splitter 430 and lens 420 create an image along path 410 b thatmimics an actual image placed at the focal point (450) of objective 400.CCD 210 records the calibration image transmitted along path 410 a and410 b.

[0038] For one embodiment, CCD 210 is a reflective CCD. Accordingly, thelight source transmitted along path 410 b is reflected through lens 420,through beam-splitter 430, and lens 440 onto focal point 450. Aspreviously described, the light source transmitted along path 410 bincludes a calibration image. Thus, a virtual calibration image isgenerated at focal point 450. In the present embodiment, system 200 usesthe virtual calibration image to calibrate DPS camera 206-210 with fixedcamera 220. In particular, system 200 correlates the pixel imagerecorded by CCD 210 to a recording of the virtual pixel image generatedby fixed camera 220, thus determining the orientation and focal point ofCCD 210 relative to fixed camera 220. System 200 also uses thepredetermined location of both the virtual calibration image and thefixed camera 220 to correlate the field of view between DPS camera206-210 and fixed camera 220. Additionally, system 200 uses thepredetermined location of both the virtual calibration image and fixedcamera 220 to calibrate the initial X, Y, and Z coordinates of DPScamera 206-210 relative to fixed camera 220. Based on theafore-mentioned calibration, system 200 ensures proper probe-to-padalignment.

[0039]FIG. 5a illustrates one embodiment of an image generator includedin the direct probe sensor camera of FIG. 3. In particular, imagegenerator 500 includes an illumination source (510), a reticle (520) anda reticle lens (530). Reticle 520 is a flat circular glass plate with ametal deposit applied to the surface of the glass plate. For oneembodiment, with the exception of the surface area delineated bycross-hair pattern 525, the metal deposit is uniformly applied to theentire glass surface. The space in the metal deposit allows the lightfrom illumination source 510 to generate a cross-hair light pattern(i.e. a calibration image) that is focused through reticle lens 530. Foralternative embodiments, the metal deposit on reticle 520 is varied togenerate different calibration images. It will be appreciated by oneskilled in the art, that the brightness of illumination source 510, thecharacteristics of reticle 520 (including but not limited to thicknessand impurity content), and the magnification strength of lens 530 may bevaried depending on the desired dimensions and brightness of thecalibration image.

[0040] For one embodiment, image generator 500 is used in conjunctionwith objective 400 and a reflective CCD. In particular, image generator500 is coupled to node 411 a and the reflective CCD is coupled to node411 b. Accordingly, the calibration image generated by image generator500 is transmitted along illumination path 410 a as a light source.Beam-splitter 430 deflects the light source transmitted on path 410 aand injects the calibration image into the normal path of light inobjective 400, path 410 b. In particular, beam-splitter 430 and lens 420create an image along path 410 b that mimics an actual calibration imageplaced at focal point 450. The reflective CCD records the calibrationimage. The reflective CCD also reflects the light source transmittedalong path 410 b back through lens 420, beam-splitter 430, and lens 440onto focal point 450 as a virtual calibration image. As previouslydescribed, the virtual calibration image is used to calibrate a DPScamera housing objective 400 to a fixed camera.

[0041] For an alternative embodiment, reticle 520 is removed from system500. Accordingly, the virtual calibration image is either all or asubset of all the pixels illuminated in the reflective CCD. Theilluminated pixels are subsequently recorded by a fixed camera. Thus,each pixel detected by the fixed camera is correlated to each pixelrecorded by a DPS camera that houses objective 400. The correlationresults in the calibration of the fixed camera and the DPS camera thathouses objective 400.

[0042]FIG. 5b illustrates one embodiment of a charge coupled deviceincluded in the direct probe sensor camera of FIG. 3. In particular, CCD540 includes an array of light sensitive transistor diodes (560), alsoreferred to as cells, that are deposited on a wafer (570). Each cell isaddressable through a control circuitry (580) that supplies power to CCD450. For one embodiment, control circuitry 580 activates all the cellsin CCD 540 for a twenty mill-second period. During the twentymilliseconds, each cell accumulates charge depending on the amount andintensity of photons striking the particular cell. For one embodiment,control circuitry 580 generate a pixel representation of the lightsource striking CCD 540 based on the cells with accumulated charge. Foralternative embodiments, control circuitry 580 activates all the cellsin CCD 540 for different time periods depending on the photon absorptionqualities of the specific CCD.

[0043] In the present embodiment, CCD 540 is used in conjunction withobjective 400 and image generator 500. In particular, image generator500 is coupled to node 411 a and CCD 540 is coupled to node 411 b.Accordingly, the calibration image generated by image generator 500 istransmitted along illumination path 410 a as a light source.Beam-splitter 430 deflects the light source transmitted on path 410 aand injects the calibration image into the normal path of light inobjective 400, path 410 b. In particular, beam-splitter 430 and lens 420create an image along path 410 b that mimics an actual calibration imageplaced at focal point 450.

[0044]FIG. 5b illustrates the charge accumulation of CCD 540 as photonsfrom the light source along path 410 b strike the surface of CCD 540. Inparticular, the cells delineated by cross-hair 550 are struck by thelight source created by image generator 500. CCD 540 records the cellswith accumulated charge via control circuitry 580, thus generating apixel representation of the light source striking CCD 540.

[0045] Following the previous example, for an alternative embodiment,CCD 540 is a reflective CCD. Accordingly, the cells struck by the lightsource transmitted along path 410 b reflects the light source backthrough lens 420, beam-splitter 430, and lens 440 onto focal point 450as a virtual calibration image. As previously described, the virtualcalibration image is used to calibrate a DPS camera housing objective400 to a fixed camera. For one embodiment, the cells of CCD 540 reflectten to thirty percent of the photons absorbed by the illuminated cells.For alternative embodiments, the reflective qualities of beam-splitter430, the displacement of the lenses (420 and 440), and the magnificationstrength of the lenses (420 and 440) may be varied depending on thereflective characteristics of CCD 540.

[0046] Thus, an apparatus and method for projecting an alignment imagehave been provided. Although the present invention has been describedwith reference to specific exemplary embodiments, it will be evidentthat various modifications and changes may be made to these embodimentswithout departing from the broader spirit and scope of the invention asset forth in the claims. Accordingly, the specification and drawings areto be regarded in an illustrative rather than a restrictive sense.

What is claimed is:
 1. A testing system operable to accurately positiona plurality of contact electrodes relative to a plurality of electricalcontacts, the testing system comprising: a first imaging system coupledto a first component, the first component configured to hold a devicecoupled to the plurality of electrical contacts, wherein the firstimaging system is configured to locate the plurality of contactelectrodes; a second imaging system coupled to a second component,wherein the second imaging system is configured to locate the pluralityof electrical contacts of the device; and an image generator coupled toat least one of the first imaging system, the first component, or thesecond component, wherein the image generator is configured to generatean alignment image in an optical path of the first imaging system, thetesting system calibrating the first imaging system to the secondimaging system using the alignment image.
 2. The testing system of claim1, wherein the electrical contacts comprise pads.
 3. The testing systemof claim 1, wherein the electrical contacts comprise probe pins.
 4. Thetesting system of claim 1, wherein the electrical contacts compriseelectrodes.
 5. The testing system of claim 1, wherein the testing systemis configured to calibrate the first imaging system to the secondimaging system by correlating the first imaging system recording of thealignment image to the second imaging system recording of the alignmentimage.
 6. The testing system of claim 5, the second imaging systemhaving a predetermined field of view, the testing system using thepredetermined field of view of the second imaging system to calibratethe first imaging system to the second imaging system.
 7. The testingsystem of claim 5, the second component having a fixed position, thetesting system using the fixed position of the second components tocalibrate the first imaging system to the second imaging system.
 8. Thetesting system of claim 1, wherein the first imaging system comprises avideo microscope having an objective lens, a rear forming lens, and abeam-splitter coupled between the objective lens and the rear forminglens, wherein the beam-splitter is configured to inject the alignmentimage into an optical path of the video microscope.
 9. The videomicroscope of claim 8, the video microscope having a charge coupleddevice, wherein the charge coupled device records the alignment image.10. The video microscope of claim 8, the video microscope having acharge coupled device, wherein the charge coupled device is configuredto reflect the alignment image on the focal point of the videomicroscope.
 11. The testing system of claim 1, wherein the firstcomponent comprises a wafer chuck.
 12. The testing system of claim 11,wherein the device comprises a wafer.
 13. The testing system of claim12, wherein the first imagining system comprises a direct probe sensecamera.
 14. The testing system of claim 13, wherein the second imaginingsystem comprises a wafer sort camera.
 15. An imaging system operable togenerate an alignment image, the imaging system comprising: an imagegenerator, the image generator configured to generate the alignmentimage; an objective coupled to the image generator, the objective havingan optical path including an objective lens, a rear forming lens, and abeam-splitter coupled between the objective lens and the rear forminglens, wherein the beam-splitter is configured to inject the alignmentimage into the optical path of the imaging system; and a charge coupleddevice coupled to the objective, wherein the charge coupled device isconfigured to reflect the alignment image on a focal point of theimaging system.
 16. The imaging system of claim 15, wherein the chargecoupled device is configured to record images located on the opticalpath of the imaging system.
 17. The imaging system of claim 15, whereinthe charge coupled device reflects the alignment image along the opticalpath.
 18. The imaging system of claim 15, wherein the imaging systemcomprises a video microscope.
 19. The video microscope of claim 18,wherein the video microscope comprises a direct probe sense camera. 20.A method for accurately positioning a plurality of contact electrodesrelative to a plurality of electrical contacts, the method comprising:generating an alignment image at a focal point of a first imaginingsystem; recording the alignment image through the first imaging system;moving the alignment image to a second imaging system; recording thealignment image through the second imaging system, wherein the field ofview of the second imaging system is determined; and calibrating thefirst imaging system to the second imaging system, wherein thecalibration is performed by correlating the alignment recording of thefirst imaging system to the alignment recording of the second imagingsystem.
 21. The method of claim 20, wherein the calibration is performedby tracking the movement of the alignment image relative to the secondimaging system and wherein the alignment image is generated by opticallyprojecting an image of the alignment image.
 22. The testing system ofclaim 20, wherein the electrical contacts comprise pads.
 23. The testingsystem of claim 20, wherein the electrical contacts comprise probe pins.24. The testing system of claim 20, wherein the electrical contactscomprise electrodes.